Molded plastic containers and carrying cases embedded with RFID tags enable tracking and monitoring of supply chain.
Vehicle tires molded to comply with AAIG B11 requirements also meets the safety and traceability requirements in "TREAD Act".
Robust High Temperature RFID Tags for Molded Tires, Plastic Pallets, Carrying Cases and Containers
AVANTE makes RFID inlays with chips based on UHF ISO 18000-6C EPC Generation 2 protocol and HF ISO 15693 and ISO 14443 in different form-factors for direct molded rubbers for tires and plastics for pallets and containers. These RFID inlets are made with patented molecularly flexible high temperature substrate and robust strap with wire-bonded chip and soldered interconnections to the RFID antennae.
EMBEDDING RFID TAG IN TIRE:
The AIAG created the B-11 in response to the Transportation Recall Enhancement, Accountability and Documentation Act (TREAD Act), which the U.S. Congress passed in November 2000, requiring all tires on new-model cars to be individually identified and traceable. B-11 conforms to the EPC in the EPCglobal Generation 2 numbering scheme and protocol, thus can be used for all ISO 18000-6C compliant application requirements. AVANTE moldable RFID inlays for tire application uses the standard compliant RFID chips to make the high temperature and molding capable tags.
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FACTORS THAT CONTRIBUTES TO MOLDABILITY AND PERFORMANCCE OF RFID INLAYS
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Requirements
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AVANTE Patented Technologies
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Traditional Methods and Technologies
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1. Molding and Molding Capability
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§ Molding temperatures depends on products and process. They can range from as low as 150°C to as high as 300°C for a few minutes. AVANTE RFID tags uses wired-bonded module for chip-level interconnections and soldering for the antenna level interconnections and high temperature flexible substrate to meet these requirements.
§ Molding includes melt-flow of the plastic or rubber compound resin and thus “mechanical stresses in all direction during flow and cooling cycles.
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§ Standard inlay substrates are polyester (PET) that deform at high temperatures. The interconnections may become loose at such high temperature processing of 150-300°C and thus render them not applicable at higher than these temperatures, Both substrate and interconnections to the chips may contributes to their difficulties in molding processing.
§ The mechanical stress involved in molding includes both mechanical push and cooling pull that tends to rendered lesser-protected interconnections in effective or diminishes its performance.
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2. High temperature stability
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§ High temperature propriety low cost substrate for long-term usage at 200°C and higher with intermittent processing stability of up to 300°C for minutes.
§ Etched copper for high temperature stability.
§ Soldered interconnections and encapsulated to protect from high temperature reflow.
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§ Standard inlay substrates are polyester (PET) that deforms at temperature at 150-180°C and melt above 200°C and thus render them not applicable at higher than these temperatures,
§ Most have printed silver inks that will deformed along with substrate melting or deforms.
§ Most uses adhesive or mechanical attached that may be detached or loosened.
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3. Long-term Interconnection stability
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§ AVANTE uses wired-bonded for its chip level interconnection and protected module for all its high temperature inlays. This proven interconnection ensures long-term stability at temperatures up to 300°C for long-term use.
§ The encapsulated module is soldered directly on etched copper for high temperature stability.
§ Soldered second level interconnections are encapsulated for processing at high temperatures beyond soldering temperature.
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§ Traditional methods uses direct mechanical contacts on aluminum, metal strap or printed silver inks. These interconnections may suffer oxidation and/or mechanical contact loosening and thus lost in read distance or reliability.
§ The metal strap or direct flip-chip first level interconnections may or may not be encapsulated.
§ The metal straps are attached to the tag antennae with adhesive or mechanical compression that may loosen over temperature and/or mechanical stress.
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EMBEDDING RFID TAG IN PLASTIC PALLET, CARRYING CASES AND CONTAINERS:
In molding plastic pallets, carrying cases and other containers, the mechanical stresses during molding at high temperature may be much higher than molding of rubbers in tire manufacturing. AVANTE RFID tags made for this applications incorporated wired-bonded strap module and soldered strap onto RFID tag antennae that are protected with encapsulation for high temperature and stress in the molding process.
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